• Develop and maintain the mechanical POR for Giga Data Centers, defining the "Gold Standard" design that enables manufacturing of reliability and efficiency at scale • Author and own the internal engineering library including technical specifications and Basis of Design documents, deciding what we build and how we measure it • Design to global and local standards, leveraging ASHRAE TC 9.9 to define environmental envelopes for AI hardware and ensuring compliance with ASHRAE 90.1 for energy efficiency • Guide external engineering firms to localize designs while maintaining strict adherence to core performance intent and standardization requirements • Validate airflow patterns and rack-level thermal performance using computational fluid dynamics, ensuring compliance with ASHRAE thermal guidelines for Class A1-A4 environments • Execute rigorous hydraulic analysis and thermal load flow studies, conducting pipe stress analysis per ASME B31 standards to ensure system integrity under thermal expansion and seismic events • Engineer complex cooling loops (Direct-to-Chip, Immersion, RDHx) aligned with OCP (Open Compute Project) specifications for liquid cooling interoperability • Select and specify pumps, fans, chillers, dry coolers, and control valves for high-density compute environments • Create detailed Bills of Material (BOMs), Quantity Take Offs (QTOs), and Commissioning scripts to support a manufacturing-first supply chain • Develop Sequence of Operations (SOO) and Control Narratives that dictate how mechanical systems respond to dynamic AI load changes • Use advanced simulation tools to optimize thermal performance and validate designs before manufacturing